Charge transfer device and a manufacturing process therefor

ABSTRACT

This invention provides a manufacturing process for a charge transfer device comprising an N-type well formed in a P-type well on a semiconductor substrate for transferring a signal charge, an N+ region formed on both sides along the charge transfer direction of the N-type well and containing a dopant in a higher concentration than that in the N-type well, a P-type region formed around the N+ region, and a gate electrode covering the N+ region and the N-type well and formed via a gate insulator, comprising ion-implanting an N-type dopant into the region to be the N-type well and the N+ region using the first mask and ion-implanting a P-type dopant into the region to be the N-type well using the second mask. Thus, there can be provided a charge transfer device which has a structure where there is an N+ region on both sides of the N-type well, a large maximum transferable charge and a compact CCD with a width up to 3 times the minimum design dimension.

This is a divisional of application Ser. No. 09/198,361, filed Nov. 24,1998, now U.S. Pat. No. 6,333,526.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates to a charge transfer device for use in, forexample, a solid-state image sensor or a delay element, and amanufacturing process therefor.

2. Description of the Related Art

A conventional charge transfer device for use in, for example, asolid-state image sensor or a delay element is shown in FIG. 6. FIGS.6(a), 6(b) and 6(c) respectively are a schematic plan view, a schematiccross section taken on line VI(b)—VI(b) of FIG. 6(a), and a schematiccross section taken on line VI(c)—VI(c), which are disclosed in JP-A57-7964.

In an n-type silicon substrate 1, there is a p-type well 2 in whichthere is an n-type well 3 in which a charge transfer channel is to beformed. There are n+ regions 4 containing an n-type dopant at a higherconcentration than that in the n-type well 3, on both sides of then-type well 3 along its charge transfer direction (the direction of lineX-X′ in the figure), and around the n+ region 4, a p+ channel stopper 7is formed. On the n-type well 3 and the n+ region 4, there are a numberof gate electrodes 6 via a gate insulator 5 consisting of, for example,an oxide film such as SiO₂.

FIG. 7 shows an electric potential distribution along line Z-Z′ of FIG.6(c), i.e., the depth direction, where a lower position has a higherpotential. In this figure, the origin of the depth direction is thesilicon/gate insulator interface, and as a specific example, 0 V isapplied to the p+ channel stopper 7 and the p-type well 2 and a lower(VL) or higher voltage (VH) to the gate electrode 6. To the n-typesilicon substrate 1, a voltage with a reverse bias to the p-type well 2is applied. The highest potential in the potential distribution alongthe depth direction shown in FIG. 7, is referred to as a “channelpotential”.

When a higher voltage (VH) is applied to a gate and a lower voltage (VL)is to two adjacent gates, electrons are transferred to beneath the gateelectrode to which the VH is applied, causing a potential reduction. Thepotential may be reduced to the channel potential of the adjacent gateelectrodes to which the VL is applied. The dotted line in this figureindicates the potential distribution at this time. An electric chargewhich may cause the potential change is the maximum transferable charge.

By reference to FIGS. 8(a), 8(b) and 8(c), a process for charge transferin the charge transfer device shown in FIG. 6(a)-6(c) will be described.FIG. 8(a) is the same schematic cross section as that shown in FIG.6(b). FIG. 8(b) shows a channel potential distribution along lineVIII(b)—VIII(b) of FIG. 8(a) at each time indicated in FIG. 8(c) FIG.8(c) shows timing of a voltage pulse applied to the gate electrode ofthe charge transfer device. FIGS. 8(a) and 8(b) are depicted in a mannerthat they horizontally have the same position, and in FIG. 8(b) a lowerposition has a higher potential. To electrodes 4V1 to 4V4 is applied abinary pulse varying between the higher (VH) and the lower (VL) voltagesas shown in FIG. 8(c).

The lower voltage is a voltage (pinning voltage) by which positive holesare stored in the silicon/oxide film interface to make the interfacepotential 0 V. In this manner, a dark current occurring via asilicon/oxide film interface level may be minimized.

The higher voltage is a voltage which is below the channel potentialwhen the lower voltage is applied. Thus, a transferred charge does notreach the silicon/oxide film interface even when a maximum transferablecharge (Qmax) is transferred, and is not trapped on the interface level.The charge can be, therefore, transferred without reduction of atransfer efficiency.

First, at time T1, the higher voltage (VH) is applied to φV1 and φV2electrodes, and the channel potential increases beneath the electrodes,to cause charge storage. The stored charge is indicated by the slantedline in FIG. 8(b). At time T2, φV3 is at the higher voltage (VH) whileφV1 at the lower voltage (VL), and thus, a charge is transferred tobeneath the electrodes φV2 and φV3. In a similar manner, at T3 and T4, acharge is transferred to beneath electrodes φV3 and φV4 and electrodesφV4 and φV1, respectively. Then, at T5, a charge is transferred tobeneath electrodes φV1 and φV2, returning to the state at Ti except thata charge is moved to the right, i.e., beneath the electrodes φV1 andφV2. By repeating the above process, a charge is sequentiallytransferred to the right direction. Such charge transfer is indicated bya right oblique downward arrow in FIG. 8(b).

Next, the reason why the maximum transferable charge (Qmax) is increasedby the charge transfer device shown in FIGS. 6(a)-6(c), will bedescribed. FIG. 9(a) is a cross section taken on line IX(a)—IX(a) ofFIG. 6(a). FIG. 9(b) shows a channel potential distribution along lineIX(b)—IX(b) of FIG. 9(a) when a lower (VL) or higher (VH) voltage isapplied, where the dotted line indicates a distribution for a chargetransfer device without an n+ region. FIG. 9(a) shows a capacity at thelocal maximum of the potential (channel position) in the n-type well 3when a voltage VG is applied to the gate electrode. A capacity betweenthe channel position and the gate electrode (Cs) is the sum of serialconnection of the gate insulator capacity and the capacity in thesilicon from the silicon/gate insulator interface to the channelposition. A capacity of both sides (Ccs) is one between the channelposition and the p+ channel stopper 7. A capacity below the channelposition (Cb) is one between the channel position and the p-type well 2.

When a voltage VG is applied to the gate electrode and 0 V is to the p+channel stopper 7 and the p-type well 2, relationship between avariation of the channel potential Δφch and a variation of the gatevoltage ΔVG can be represented by the following equation:

Δφch=ΔVG·Cs/(Cs+2Ccs+Cb)

A charge stored beneath the gate electrode can be substantiallyrepresented by the following equation: $\begin{matrix}\begin{matrix}{{\Delta \quad Q} = {{\Delta\varphi}\quad {{ch} \cdot \left( {{Cs} + {2{Ccs}} + {Cb}} \right)}}} \\{= {\Delta \quad {{VG} \cdot {Cs}}}}\end{matrix} & (1)\end{matrix}$

A value obtained by integrating the above Equation (1) with thevariation (amplitude) of the gate electrode is the maximum transferablecharge (Qmax). It will be understood that when the amplitude isconstant, a larger Cs gives a larger Qmax.

The solid line in FIG. 9(b) indicating the channel potentialdistribution along line V-V′ when a lower (VL) or higher (VH) voltage isapplied to the gate electrode, will be referred. The horizontal positionis matched with the corresponding position in FIG. 9(a).

A concentration and a width in the n+ region 4 is adjusted so that whenthe lower voltage (VL) is applied, the curved channel potential line ischanged within the n+ region 4 to be straight throughout the n-type well3. When the higher voltage (VH) is applied, a depletion layer formed byp-n junction between the p+ channel stopper 7 and the n+ region 4 isextended to enter the n-type well 3. The straight part of the channelpotential is, therefore, shorter than one when the lower voltage (VL) isapplied. A capacity between the straight part of the channel potentialand the gate electrode is Cs, which contributes a charge as indicated byEquation (1). On the other hand, the n+ region 4 forms p-n junction withthe p+ channel stopper 7, and a potential increases from 0 V on thestopper side to φch. The capacity of this part is Ccs, which does notcontribute charge according to Equation (1). Increase of the straightpart of the channel potential, therefore, leads to increase of Qmax.

In FIG. 9(b), the dotted line indicates a channel potential distributionalong line V-V′ when without the n+ region 4, a lower (VL) or higher(VH) voltage is applied to the gate electrode. Since in this case, aconcentration of the n-type dopant is lower than that in the n+ region,the curve of the channel potential is gentler around both ends, and thusthe straight part of the channel potential is shorter.

As described above, increase of Qmax in the charge transfer device inFIGS. 6(a)-6(c) is owing to the fact that the device has the n+ region,leading to a steeper curve (rate of change) of the channel potentialaround both ends and increase in the straight part of the channelpotential.

Next, a manufacturing process for the charge transfer device shown inFIGS. 6(a)-6(c) will be described. FIGS. 10(a)-10(d) are schematiccross-sectional process views, showing each manufacturing step with across section taken along line VI(c)—VI(c) of FIG. 6(a).

First, boron is ion-implanted with an energy of 150 to 200 keV and adosage of 1 to 5×10¹²/cm² on the surface of an n-type of siliconsubstrate 1 having a phosphorus concentration of an order of 10¹⁴/cm³; ap-type well 2 is formed by heating at 1200° C. for 30 min to 2 hours;and then an oxide film 9 is formed by wet oxidation at 900° C. for about7 min. As shown in FIG. 10(a), on the film a photoresist 81 is formedwith a thickness of about 2 μm by a photolithography technique and thenboron is ion-implanted with an energy of 20 to 40 keV and a dosage of 1to 5×10¹³/cm², to form a p+ channel stopper 7.

Next, after removing the photoresist 81, a photoresist 82 with athickness of about 2 μm as shown in FIG. 10(b), and then phosphorus ision-implanted with an energy of 70 to 150 keV and a dosage of 1 to5×10¹²/cm², to form an n-type well 3.

Then, after removing the photoresist 82, photoresists 83 a and 83 b witha thickness of about 2 μm are formed and ions are implanted to bothsides of the n-type well 3, with the same energy as that for the aboven-type well 3 and with a dosage 0.2 to 2 times as high as that for then-type well 3, to form an n+ region 4.

Then, after removing the photoresist, the substrate is heated at 950 to980° C. for 30 min to 1 hour under an atmosphere of nitrogen, toactivate the ion-implanted dopant, and then the oxide film 9 iswet-etched with hydrofluoric acid.

Then, as shown in FIG. 10(d), a gate insulator 5 is formed by wetoxidation at 900 to 980° C. for 5 to 30 min, on which a polysilicon gateelectrode 6 doped with a dopant by lithography and etching, to provide acharge transfer device as shown in FIGS. 6(a)-6(c).

However, if the conventional charge transfer device as shown in FIGS.6(a)-6(c) is prepared by the above manufacturing process as shown inFIGS. 10(a)-10(d), reduction in the width of the n-type well gives thenarrower photoresist 83 a in FIG. 10(c), causing peeling or falling ofthe photoresist. As an example in which the problem may be prominent, aninterlined type of two-dimensional CCD image sensor will be described.interline type of two-dimensional CCD image sensor will be described.

FIG. 11 schematically shows an interline type of CCD image sensor.Adjacent to each photodiode array which is two-dimensionally aligned, avertical CCD 12 is formed, which is connected with the photodiodes 10via transfer gates 11. There are provided p+ channel stoppers 15, forexample, between photodiodes 10, between a photodiode 10 and thevertical CCD 12 as well as between a photodiode 10 and horizontal CCD13. The lower end of each vertical CCD 12 is connected with thehorizontal CCD 13, an end of which is connected with an amplifier 14. Asignal charge which has been obtained by photo electric conversion isread out to the vertical CCD 12 via the transfer gates 11, thentransferred at the vertical CCD 12 and the horizontal CCD 13, and thenamplified by the amplifier 14 to be output. The region enclosed by thedotted line in the figure is a unit pixel 16, whose size has beenrecently reduced as a two-dimensional CCD image sensor has have areduced size of chip and more pixels.

However, it is desirable to increase the area of the photodiode 10 asmuch as possible for ensuring a certain sensitivity or capacity of thephotodiode. To this end, it is desired that a transfer charge per a unitarea of the vertical CCD 12 is increased to reduce the area of thevertical CCD 12.

If the charge transfer device shown in FIGS. 6(a)-6(c) is applied to avertical CCD for solving the problem, there may be difficulty in theabove manufacturing process as shown in FIGS. 10(a)-10(d), due to thefact that as the n-type well 3 becomes narrower, the photoresist 83 abecomes narrower. In an interline type of two-dimensional CCD imagesensor, a pixel has been gradually miniaturized and the minimum pixelreported to date corresponds to a square whose sides have a length ofabout 4 to 5 μm. In the sensor, the vertical CCD has a width of below1.5 μm, which is the distance between the p+ channel stoppers 7 in FIGS.10(a)-10(d). An opening of the photoresist shown in FIG. 10(c) whoseminimum design dimension is 0.5 μm, has a dimension of 0.5 μm, and thewidth of the photoresist 83 a is below 0.5 μm. In an optical format of ½inch, the length of the vertical CCD is below about 5 mm, and therefore,the photoresist 83 a is stripe-shaped with a width of below 0.5 μm and alength of 5 mm. Such a shape is likely to cause peeling or falling dueto inadequate adhesion of the photoresist, which may be prominent whenthe width of the vertical CCD is further reduced. Because of the aboveproblems, it has been very difficult to prepare a charge transfer devicewhose vertical CCD width is below 1.5 μm, in the shape shown in FIGS.6(a)-6(c), according to the process of the prior art.

SUMMARY OF THE INVENTION

In the light of the above description, an objective of this invention isthus to provide a charge transfer device which has a structure shown inFIGS. 6(a)-6(c), a large maximum transferable charge and a compact CCDwith a width of below 1.5 μm (up to 3 times the minimum designdimension), without using a narrow and long photoresist pattern which islikely to cause peeling or falling as described above.

We have attained this invention by intensively attempting to achieve theabove objective.

This invention provides a manufacturing process for a charge transferdevice comprising a well of second conduction type formed in a well offirst conduction type on a semiconductor substrate for transferring asignal charge, a region of second conduction type formed on at least oneof both sides along the charge transfer direction of the well of secondconduction type and containing a dopant in a higher concentration thanthat in the well of second conduction type, a region of first conductiontype formed around the region of second conduction type or the well ofsecond conduction type, and a gate electrode covering at least the wellof second conduction type and the region of second conduction type andformed via a gate insulator, comprising at least ion-implanting a dopantof second conduction type of into the region to be the well of secondconduction type and the region of second conduction type using the firstmask and ion-implanting a dopant of first conduction type into theregion to be the well of second conduction type using the second mask.

This invention further provides a manufacturing process for a chargetransfer device comprising a well of second conduction type formed in awell of first conduction type on a semiconductor substrate fortransferring a signal charge, a region of second conduction type formedon one side along the charge transfer direction of the well of secondconduction type and containing a dopant in a higher concentration thanthat in the well of second conduction type, a region of first conductiontype formed around each of the region of second conduction type and thewell of second conduction type, and a gate electrode covering at leastthe well of second conduction type and the region of second conductiontype and formed via a gate insulator, comprising at least ion-implantinga dopant of second conduction type into the region to be the well ofsecond conduction type and the region of second conduction type using amask, and ion-implanting a dopant of first conduction type from adirection tilted from the normal line of the substrate face to onedirection unparallel to the charge transfer direction, at predetermineddosage and energy using the above mask.

This invention further provides a manufacturing process for a chargetransfer device comprising a well of second conduction type formed in awell of first conduction type on a semiconductor substrate fortransferring a signal charge, a region of second conduction type formedon both sides along the charge transfer direction of the well of secondconduction type and containing a dopant in a higher concentration thanthat in the well of second conduction type, a region of first conductiontype formed around the region of second conduction type, and a gateelectrode covering at least the well of second conduction type and theregion of second conduction type and formed via a gate insulator,comprising at least ion-implanting a dopant of second conduction typeinto the region to be the well of second conduction type and the regionof second conduction type using a mask, ion-implanting a dopant of firstconduction type from the first direction tilted from the normal line ofthe substrate face to the direction unparallel to the charge transferdirection, at the first dosage and the first energy using the abovemask, and ion-implanting a dopant of first conduction type from thesecond direction tilted from the normal line of the substrate face tothe direction unparallel to the charge transfer direction, at the seconddosage and the second energy using the above mask.

This invention further provides a charge transfer device comprising awell of second conduction type formed in a well of first conduction typeon a semiconductor substrate for transferring a signal charge, a regionof second conduction type formed on at least one of both sides along thecharge transfer direction of the well of second conduction type andcontaining a dopant in a higher concentration than that in the well ofsecond conduction type of, a region of first conduction type formedaround the region of second conduction type or the well of secondconduction type, and a gate electrode covering at least the well ofsecond conduction type and the region of second conduction type andformed via a gate insulator, wherein the sum of the widths of the wellof second conduction type and the region of second conduction type is upto three times as large as the minimum design dimension.

This invention further provides a charge transfer device comprising awell of second conduction type formed in a well of first conduction typeon a semiconductor substrate for transferring a signal charge, a regionof second conduction type formed on both sides along the charge transferdirection of the well of second conduction type and containing a dopantin a higher concentration than that in the well of second conductiontype, regions of first conduction type having different dopantconcentrations formed around the region of second conduction type, and agate electrode covering at least the well of second conduction type andthe region of second conduction type and formed via a gate insulator,wherein the region of second conduction type on the side of the regionof first conduction type with a lower dopant concentration is narrowerthan the other region of second conduction type.

This invention further provides a charge transfer device comprising awell of second conduction type formed in a well of first conduction typeon a semiconductor substrate for transferring a signal charge, a regionof second conduction type formed on both sides along the charge transferdirection of the well of second conduction type and containing a dopantin a higher concentration than that in the well of second conductiontype, regions of first conduction type having different dopantconcentrations formed around the region of second conduction type, and agate electrode covering at least the well of second conduction type andthe region of second conduction type and formed via a gate insulator,wherein the region of second conduction type on the side of the regionof first conduction type with a lower dopant concentration has a lowerdopant concentration than that of the other region of second conductiontype.

In the manufacturing process for a charge transfer device of thisinvention, for example, an n-type dopant is ion-implanted to the regionto be an n-type well and an n+ region from an opening of the firstphotoresist, and a p-type dopant is ion-implanted to the region to be ann-type well from an opening of the second photoresist. As a result, anarrow and long photoresist pattern in which peeling or falling islikely to occur may not be formed and the width of the n+ region dependson the distance between the end of the photoresist opening and the p+channel stopper, and may be thus smaller than the minimum designdimension. Therefore, a desired charge transfer device can be provided,whose CCD width (the sum of the n-type well and the n+ regions on bothsides) may be up to three times as large as the minimum designdimension, and whose maximum transferable charge is increased.

According to the manufacturing process of this invention, a p-typedopant may be ion-implanted from a direction tilted from the normal lineof the substrate to the direction nonparallel to the charge transferdirection, to make the n-type well narrower, which may allow the CCDwidth to be further reduced.

In addition, in the process of this invention, a p-type dopant ision-implanted using a photoresist for implantation of an n-type dopant,twice from directions tilted from the normal line of the substrate faceto the right and left directions nonparallel to the charge transferdirection, to form an n+ region in a self-aligned manner. During theimplantation, ions may be implanted from the right and the leftdirections tilted by the same angle, with the same energy and the samedosage, to form n+ regions with the same dimensions on the right and theleft sides.

As described above, there can be provided a charge transfer device whoseCCD has a width of up to three times as large as the minimum designdimension and which has an increased maximum transferable charge.

Thus, this invention can provide a compact charge transfer device whichhas a structure comprising an n+ region on at least one of two sides ofan n-type well, has a large maximum transferable charge and has a CCDwidth up to three times as large as the minimum design dimension.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1(a)-1(d) are schematic cross-sectional process views of themanufacturing process for the charge transfer device in the firstembodiment of this invention.

FIGS. 2(a)-2(c) are schematic cross-sectional process views of themanufacturing process for the charge transfer device in the secondembodiment of this invention.

FIGS. 3(a) and 3(b) shows a channel potential distribution taken alongline III—III of FIG. 2(c). FIG. 3(a) illustrates the channel potentialdistribution when the dopant concentration of the left p+ channelstopper is lower than that of the right p+ channel stopper and the rightand the left n+ regions have the same width (prior art). FIG. 3(b)illustrates the channel potential distribution when the dopantconcentration on the left p+ channel stopper is lower than that of theright p+ channel stopper and the left n+ region is narrower than theright region (this invention). The solid line indicates a distributionwhen both p+ channel stoppers (107, 110) have the same dopantconcentration and both n+ regions (104(a , 104(b) have the same width.

FIGS. 4(a)-4(e) are schematic cross-sectional process views of themanufacturing process for the charge transfer device in the thirdembodiment of this invention.

FIGS. 5(a)-5(d) are schematic cross-sectional process views of themanufacturing process for the charge transfer device in the fourthembodiment of this invention.

FIGS. 6(a)-6(c) are explanatory figures for a charge transfer device, inwhich FIG. 6(a) is a schematic plan view, FIG. 6(b) a schematic crosssection taken along line VI(b)—VI(b) of FIG. 6(a), and FIG. 6(c) is aschematic cross section taken along line VI(c)—VI(c) of FIG. 6(a).

FIG. 7 shows an electric potential distribution along line VII—VII ofFIG. 6(c), i.e., the depth direction, when a voltage is applied to theelectrode.

FIGS. 8(a)-8(c) illustrate a process for transferring charge with acharge transfer device.

FIGS. 9(a)-9(b) illustrate the reason why a charge transfer device withan n+ region has a higher maximum transferable charge than one withoutan n+ region.

FIGS. 10(a)-10(d) are schematic cross-sectional process views of themanufacturing process for the charge transfer device of the prior art.

FIG. 11 is a schematic explanatory figure of a two-dimensional CCD imagesensor.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

In the manufacturing process of this invention, it is preferable thatwhen a p-type dopant is ion-implanted from a direction tilted from thenormal line of the substrate face to the direction unparallel to thecharge transfer direction to form a narrower n-type well, the center ofthe opening in the first photoresist during implantation of an n-typedopant in a manner that the n-type well is formed at the center line ofthe CCD is at a different position from the center line of the openingin the second photoresist during implantation of the p-type dopant.

In the manufacturing process of this invention, it is preferable thatwhen the p+ channel stoppers around the n+ regions on the right and theleft sides along the charge transfer direction of the n-type well havedifferent dopant concentrations from each other, the n+ region on the p+channel stopper side with a lower dopant concentration has a narrowerwidth or a lower dopant concentration.

To this end, it is preferable that the center line of the chargetransfer direction for the photoresist opening into which the p-typedopant is ion-implanted is different from the center line of the CCD.Alternatively, in a process in which the p-type dopant is ion-implantedusing the photoresist for implanting the n-type dopant, twice fromdirections tilted from the normal line of the substrate face to theright and left directions unparallel to the charge transfer direction toform the n+ region in a self-aligned manner, it may be preferable thatthe tilt angles during ion-implantation may be varied to provide anarrower n+ region on the side of the p+ channel stopper with a lowerdopant concentration, or dosages from the right and the left may bedifferent from each other to lower the dopant concentration of the n+region on the p+ channel stopper side with a lower dopant concentration.

By reference to the accompanying drawings, some embodiments of thisinvention will be described, where a transferred charge is carried byelectrons.

First Embodiment

FIGS. 1(a)-1(d) are schematic cross-sectional process views forillustrating the first embodiment of the manufacturing process for acharge transfer device of this invention with an increased maximumtransferable charge, showing the same cross section as that in FIG.6(c). Other structural parts, a charge transfer procedure, and thereason for increase of the maximum transferable charge are as describedfor the prior art, and therefore will not be described.

First, boron is ion-implanted with an energy of 150 to 200 keV and adosage of 1 to 5×10¹²/cm² on the surface of an n-type of siliconsubstrate 101 having a phosphorus concentration of an order of 10¹⁴/cm³;a p-type well 102 is formed by heating at 1200° C. for 30 min to 2hours; and then an oxide film 109 is formed by wet oxidation at 900° C.for about 7 min. As shown in FIG. 1(a), on the film is formed aphotoresist 181 with a thickness of about 2 μm by a photolithographytechnique and then boron is ion-implanted with an energy of 20 to 40 keVand a dosage of 1 to 5×10¹³/cm², to form a p+ channel stopper 107.

Next, after removing the photoresist 181, a photoresist 182 with athickness of about 2 μm as shown in FIG. 1(b), and then phosphorus ision-implanted with an energy of 70 to 150 keV and a dosage of 1.2 to10×10¹²/cm², to form an n+ region 104. The dosage is preferably 1.2 to 2times as much as that for forming the n-type well 3 in the process ofthe prior art and the multiplying rate should be the same as the dopantconcentration ratio of the n+ region/the n-type well. In brief, thedosage should be selected so as to attain a similar dopant concentrationto that in the n+ region 4 in the prior art. Furthermore, the dosageshould be selected so that the dopant concentration in the central part103 is similar to that in the n-type well 3 in the prior art after anext ion-implantation of boron.

Next, after removing the photoresist 182, a photoresist 183 with athickness of about 2 μm as shown in FIG. 1(c), and then boron ision-implanted with an energy of 25 to 60 keV and a dosage of 0.2 to5×10¹²/cm², to form an n type well 103. The dosage of the boronimplantation should be selected so that a value obtained by subtractingthe p-type dopant concentration from the n-type dopant concentration inthe central n+ region 104 is the substantially same as the n-type dopantconcentration in the n-type well according to the process of the priorart. Since the difference between the n-type dopant and the p-typedopant concentrations affects the electric properties of the device, thedifference is hereinafter referred to as a “substantial dopantconcentration”. In addition, the energy during ion-implanting should bepreferably selected so that the peaks in the concentration distributionsin the depth direction for phosphorus and boron substantially overlap.

Then, after removing the photoresist 183, the substrate is heated at 950to 980° C. for 30 min to 1 hour under an atmosphere of nitrogen, toactivate the ion-implanted dopant, and then the oxide film 109 iswet-etched with hydrofluoric acid.

Then, as shown in FIG. 1(d), a gate insulator 105 is formed by wetoxidation at 900 to 980° C. for 5 to 30 min, on which a polysilicon gateelectrode 106 doped with a dopant by lithography and etching, to providea charge transfer device as shown in FIG. 6(a)-6(c).

The photoresist 183 in the step in FIG. 1(c) is not narrow in contrastwith the photoresist 83 a in the prior art shown in FIG. 10(c), andtherefore does not permit peeling or falling.

The size of the opening of the photoresist 183 may be reduced to theminimum design dimensions and the width of the n+ region depends on thepositions of the openings in the p+ channel stopper 107 and thephotoresist 183. Therefore, the width of the n+ region can be reduced toa dimension which is below the minimum design dimension and equal to orlarger than the photoresist setting precision in the photolithography.The n+ region plays a role for making the curve (rate of change) of thechannel potential steeper in the part, and the width can be reduced byincreasing the concentration. Therefore, for example, when the minimumdesign dimension is 0.5 μm and the width of the n+ region on one side is0.2 μm, the sum of the widths of the n-type well 103 and of both n+regions is 0.9 μm. Thus, the manufacturing process of this invention canprovide a charge transfer device with n+ regions on both sides of then-type well even when the CCD has a width below three times the minimumdesign dimension.

As an improved variation of this embodiment, the CCD may be furthernarrowed by tilting the boron-implanting direction from the normal lineof the substrate face to the direction unparallel to the charge transferdirection, to narrow a region subject to boron-ion implantation, i.e.,the region of the n-type well 103, and moving the outer end of one(right or left) n+ region toward the n-type well to make the widths ofboth sides of n+ regions equal. In the case, the center line of theopening in the photoresist 182 is at a different position from thecenter line of the opening in the photoresist 183.

Second Embodiment

FIG. 2(a)-2(c) are schematic cross-sectional process views forillustrating the second embodiment, showing a manufacturing process fora charge transfer device in which p+ channel stoppers on both sides ofthe n+ region have different dopant concentrations from each other. FIG.2(a)-2(c) depict the process with a similar cross section to FIG. 6(c),and uses the same symbols as those in the first embodiment shown inFIGS. 1(a)-1(d) for the same structural parts.

This embodiment is different from the first embodiment shown in FIGS.1(a)-1(d) in that the left p+ channel stopper 110 has a lower dopantconcentration than that in the right p+ channel stopper 107, that in thestep of FIG. 2(b) the boron-implantation area in the n+ region 104 isnot the center part of the n+ region 104, but is extended or movedtoward one p+ channel stopper 110.

Thus, the width of the left n+ region 104 a is narrower than that of theright n+ region 104 b. A difference between the widths of the right andthe left n+ regions is a function of the dopant concentrations of the n+regions, and it is preferable that the width of the left n+ region 104 ais narrower than that of the right n+ region 104 b by about 0.1 to 0.3μm, for which a setting process will be described later.

The manufacturing process for a charge transfer device shown in FIGS.2(a)-2(c) comprises the same steps as those in the first embodimentshown in FIGS. 1(a)-1(d) except the step for forming p+ channel stoppers107 and 110 with different dopant concentrations and a differentposition of the photoresist 183 in the step shown in FIG. 2(b). Theprocess will not be, therefore, described.

A structure in which p+ channel stoppers of a CCD on both sides havedifferent dopant concentrations from each other, can be observed in, forexample, the CCD image sensor shown in FIG. 11, in which a transfer gateis connected with one side of a vertical CCD. The transfer gate iscomposed of a p-type semiconductor consisting of an enhancement typetransistor of an n channel, whose threshold voltage is 0 to 1 V andwhose p-type dopant concentration is lower than that of the p+ channelstopper by at least one order and in the same order as the n-type well.

FIGS. 3(a) and (b) show a channel potential distribution along lineIII—III of FIG. 2(c) when a lower voltage (VL) is applied to the gateelectrode and the dopant concentration of the left p+ channel stopper110 is lower than that of the right p+ channel stopper 107.Specifically, FIGS. 3(a) and 3(b) show distributions when the n+ regions104 a and 104 b have the same width and when the n+ region 104 a isnarrower than the n+ region 104 b in this embodiment, respectively,where the solid line indicates a distribution when both p+ channelstoppers (107, 110) have the same dopant concentration and both n+regions (104 a, 104 b) have the same width.

The dotted line 130 in FIG. 3(a) indicates a channel potentialdistribution when the left p+ channel stopper (110) has a lower dopantconcentration and both n+ regions (104 a, 104 b) have the same width,where a channel potential curve around the right p+ channel stopper isrepresented by the sold line. When the dopant concentration in the leftp+ channel stopper is reduced to the same order as that in the n+region, the depletion layer in the n+ region is reduced and the channelpotential depends on p-n junction with the p-type well rather than p-njunction with the p+ channel stopper. When the channel potential dependson p-n junction with the p-type well, and when the n+ region and then-type well are depleted, the channel potential is increased due to ahigher phosphorus concentration in the n+ region, resulting in apotential dip in the n+ region 104 a (see the dotted line 130).Formation of such a dip leads to increase of a drive amplitude becausewhen the depth of the n-type well is constant, a higher dopantconcentration leads to a lower gate voltage required to store positiveholes in a silicon/oxide film interface (pinning voltage).

The dotted lines 131 a and 131 b in FIG. 3(a) indicate channel potentialdistributions in the n+ region when the dopant concentration in theregion is reduced to avoid formation of such a potential dip in the leftn+ region. As seen in this figure, reduction of the dopant concentrationin the n+ region makes the potential curve gentler and the flat part ofthe channel potential narrower, leading to reduction of Cs (i.e., acapacity between the channel position and the gate electrode) and Qmax.

When the left n+ region 104 a is narrower than the right n+ region 104 bwith keeping the dopant concentration in the n+ region constant as theembodiment of FIGS. 2(a)-2(c) shows, a potential dip does not appear andthe flat part of the channel potential is not reduced as shown in FIG.3(b) (the dotted line 132). A difference between the widths of the rightand the left n+ regions is a function of the dopant concentrations ofthe n+ regions, and it is preferable that the width of the left n+region 104 a is narrower than that of the right n+ region 104 b by about0.1 to 0.3 μm, by which a charge transfer device with an increased Qmaxcan be provided.

Third Embodiment

FIGS. 4(a)-4(e) are schematic cross-sectional process views forillustrating the third embodiment of the manufacturing process for acharge transfer device with an increased maximum transferable charge,showing the same cross section as that in FIG. 6(c). Other structuralparts, a charge transfer procedure, and the reason for increase of themaximum transferable charge are as described for the prior art, andtherefore will not be described. The same symbols as those in the firstembodiment shown in FIGS. 1(a)-1(d) are used for the same structuralparts.

This embodiment is different from the first embodiment shown in FIGS.1(a)-1(d) in that the n+ region 142 is formed using the photoresist 182for forming the n-type region rather than a dedicated photoresist andthat boron is ion-implanted from an oblique direction to the opening ofthe photoresist 182, whereby the n+ region can be formed without shiftfrom the n-type well.

First, boron is ion-implanted with an energy of 150 to 200 keV and adosage of 1 to 5×10¹²/cm² on the surface of an n-type of siliconsubstrate 101 having a phosphorus concentration of an order of 10¹⁴/cm³;a p-type well 102 is formed by heating at 1200° C. for 30 min to 2hours; and then an oxide film 109 is formed by wet oxidation at 900° C.for about 7 min. As shown in FIG. 4(a), on the film is formed aphotoresist 181 with a thickness of about 2 μm by a photolithographytechnique and then boron is ion-implanted with an energy of 20 to 40 keVand a dosage of 1 to 5×10¹³/cm², to form a p+ channel stopper 107.

Next, after removing the photoresist 181, a photoresist 182 with athickness of about 2 μm is formed as shown in FIG. 4(b), and thenphosphorus is ion-implanted with an energy of 70 to 150 keV and a dosageof 1.4 to 15×10¹²/cm², to form an n+ region 141. The dosage ispreferably 1.4 to 3 times as much as that for forming the n-type well 3in the process of the prior art. The multiplying rate may be representedby “2a−1” when it is desired to attain the substantial dopantconcentration of the n+ region “a” times as much as that in the n-typewell. It is preferable that the dosage is selected so as to attain asimilar substantial dopant concentration in the central part 144 to thatin the n-type well 3 in the prior art.

Next, using the same photoresist 182, boron is ion-implanted with anenergy of 25 to 60 keV and a dosage of 0.2 to 5×10¹²/cm² from adirection tilted from the vertical direction to the left by 5 to 20 V(indicated by α in this figure) as shown in FIG. 4(c), to form an n+region 142 in which the n-type dopant is diluted by the p-type dopant.The dosage should be selected so that the substantial dopantconcentration in terms of the electric properties of the n+ region 142is similar to that of the n+ region 4 in the structure of the prior art.It is preferable that the energy in the ion implantation is selected sothat the peaks of the concentration distributions in the depth directionfor phosphorus and boron substantially overlap. In this case, the regionto a distance d1 from the right end of the opening in the photoresist isnot subject to boron-implantation, leaving the n+ region 141. Thedistance d1 may be determined by the following equation:

d1=L·tan α  (2)

where L represents the sum of the thickness of the photoresist and thethickness of the oxide film 109. The distance d1 may be, therefore,controlled by the thickness BL and the incident angle α.

Then, using the same photoresist 182, boron is ion-implanted as shown inFIG. 4(d) with the same energy and dosage as those in the step shown inFIG. 4(c) from the direction tilted from the vertical direction to theright by the same angle (indicated by a in this figure) as that in thestep shown in FIG. 4(c), to form an n-type well 144 in which the n-typedopant is further diluted by the p-type dopant. The substantial dopantconcentration in terms of the electric properties of the n-type well 144is similar to that of the n-type well 3 according to the prior art.

The distance from the left end of the opening of the photoresist whereis not subject to boron implantation due to the photoresist 182 is thesame as d1 in the step shown in FIG. 4(c). The substantial dopantconcentration in the area to the distance d1 from the left end of theopening of the photoresist is the same as that in the n+ region 142 inFIG. 4(c). The substantial dopant concentration in the area to thedistance d1 from the right end of the opening of the photoresist isdiluted by the boron implantation shown in this figure to also becomethe same as that in the n+ region 142 in FIG. 4(c).

Then, after removing the photoresist 182, the substrate is heated at 950to 980° C. for 30 min to 1 hour under an atmosphere of nitrogen, toactivate the ion-implanted dopant, and then the oxide film 109 iswet-etched with hydrofluoric acid.

Then, as shown in FIG. 4(e), a gate insulator 105 is formed by wetoxidation at 900 to 980° C. for 5 to 30 min, on which a polysilicon gateelectrode 106 doped with a dopant by photolithography and etching, toprovide a charge transfer device as shown in FIGS. 6(a)-6(c).

The photoresist 182 in the step in FIGS. 4(b) to 4(d) is not narrow incontrast with the photoresist 83 a in the prior art shown in FIG. 10(c),and therefore does not permit peeling or falling.

The size of the opening of the photoresist 182 may be reduced to theminimum design dimensions and the width of the n+ region depends on thethickness L and the boron incident angle α. The n+ region plays a rolefor making the curve (rate of change) of the channel potential steeperin the part, and the width can be reduced by increasing the substantialdopant concentration. Therefore, the sum of the widths of the n-typewell 144 and of both n+ regions 142 can be reduced to the minimum designdimension. Thus, the manufacturing process of this invention can providea charge transfer device with n+ regions on both sides of the n-typewell even when the CCD has a width below three times the minimum designdimension.

In the steps of FIGS. 4(c) and 4(d), boron is ion-implanted from adirection tilted from the normal line of the substrate face to onedirection vertical to the charge transfer direction. But boron may beion-implanted from a direction tilted from the normal line of thesubstrate face to one direction unvertical to the charge transferdirection as far as the direction has a component of vertical directionto the charge transfer direction. That is to say, boron may beion-implanted from a direction tilted from the normal line of thesubstrate face to one direction unparallel to the charge transferdirection.

Fourth Embodiment

FIGS. 5(a)-5(d) are schematic cross-sectional process view forillustrating the fourth embodiment of the manufacturing process of thisinvention, showing a manufacturing process for a charge transfer devicein which p+ channel stoppers on both sides of the n+ region havedifferent dopant concentrations from each other. FIGS. 5(a)-5(d) depictthe process with a similar cross section to FIG. 6(c), and uses the samesymbols as those in the third embodiment shown in FIGS. 4(a)-4(e) forthe same structural parts.

This embodiment shown in FIGS. 5(a)-5(d) is different from the thirdembodiment shown in FIGS. 4(a)-4(e) in that the left p+ channel stopper110 has a lower dopant concentration than that in the right p+ channelstopper 107 and that in the step of FIG. 5(c) a boron incident angle αis smaller than the incident angle α in the step shown in FIG. 5(b) anda distance d2 to which boron is not implanted due to the photoresist 182is shorter than the distance d1 in the step shown in FIG. 5(b).

Thus, the width of the left n+ region 143 is narrower than that of theright n+ region 142. A difference between the widths of the right andthe left n+ regions is a function of the dopant concentrations of the n+regions, and it is preferable that the width of the left n+ region 143is narrower than that of the right n+ region 142 by about 0.1 to 0.3 μm,for which the setting process has been described for the secondembodiment. Thus, a charge transfer device with an increased Qmax can beprovided without increase in a driving voltage.

The manufacturing process for a charge transfer device shown in FIGS.5(a)-5(d) is different from the third embodiment shown in FIGS.4(a)-4(e) only in the fact that the boron incident angle α in the stepshown in FIG. 5(c) is smaller than the incident angle α in the stepshown in FIG. 5(b). The process will not be, therefore, described.

Since in this embodiment the distance to which boron is not implanteddue to the photoresist may be estimated by Equation (2), an incidentangle β for providing a desired distance d2 may be readily calculated.

In the third embodiment shown in FIGS. 4(a)-4(e) (for the incidentangles α=β), when the dopant concentration in the left p+ channelstopper 110 is lower than that in the right p+ channel stopper 107 as isin this embodiment shown in FIGS. 5(a)-5(d), the boron dosage in thestep of FIG. 4(d) may be lower than that in the step of FIG. 4(c), toprovide a charge transfer device exhibiting a channel potential curvewithout a potential dip as indicated by the dotted line 131 a in theleft side area of the potential distribution and the solid line in theright side area of the potential distribution in FIG. 3(a). Thisprocedure may be also applied to the steps of FIGS. 5(b) and 5(c) in thefourth embodiment.

In the steps of FIGS. 5(b) and 5(c), boron is ion-implanted from adirection tilted from the normal line of the substrate face to onedirection vertical to the charge transfer direction. But boron may beion-implanted from a direction tilted from the normal line of thesubstrate face to one direction unvertical to the charge transferdirection as far as the direction has a component of vertical directionto the charge transfer direction. That is to say, boron may beion-implanted from a direction tilted from the normal line of thesubstrate face to one direction unparallel to the charge transferdirection.

As described above, the n+ regions are formed on both sides of then-type well, but it will be clearly understood that the abovedescription may be also applied to the case where an n+ region is formedon one side of an n-type well, although in such a case a maximumtransferable charge will be lower than that when the n+ regions areformed on both sides.

Arsenic may be implanted in place of phosphorus as described above forforming an n-type. In the above description, a charge is carried byelectrons, but when positive holes carry a charge this invention may beapplied by interchanging n-type and p-type dopants and reversing thedirection of an applied voltage. A gate insulator is not limited to anoxide film, and may be a multilayer of oxide and nitride films. The gateelectrode is a single layer in the above description, but it may be anoverlapped electrode where 2 or 3 layers of polysilicon gate electrodesare multilayer and overlap in part. Furthermore, this invention may beapplied to not only four-phase but also two- or three-phase chargetransfer systems.

What is claimed is:
 1. A manufacturing process for a charge transferdevice comprising a well of second conduction type formed in a well offirst conduction type on a semiconductor substrate for transferring asignal charge, a region of second conduction type formed on at least oneof both sides along the charge transfer direction of the well of secondconduction type and containing a dopant in a higher concentration thanthat in the well of second conduction type, a region of first conductiontype formed around the region of second conduction type or the well ofsecond conduction type, and a gate electrode covering at least the wellof second conduction type and the region of second conduction type andformed via a gate insulator, comprising at least ion-implanting a dopantof second conduction type into the region to be the well of secondconduction type and the region of second conduction type using the firstmask and ion-implanting a dopant of first conduction type into theregion to be the well of second conduction type using the second mask.2. A manufacturing process for a charge transfer device as is claimed inclaim 1, where in the step of ion-implanting the dopant of firstconduction type into the region to be the well of second conduction typeusing the second mask, ions are implanted from one direction tilted fromthe normal line of the substrate face to one direction unparallel to thecharge transfer direction.
 3. A manufacturing process for a chargetransfer device as is claimed in claim 2, where in the step ofion-implanting the dopant of first conduction type into the region to bethe well of second conduction type using the second mask, the secondmask is formed in a manner that it has a center line in the chargetransfer direction shifted from that in the first mask and then thedopant of first conduction type is ion-implanted.
 4. A manufacturingprocess for a charge transfer device comprising a well of secondconduction type formed in a well of first conduction type on asemiconductor substrate for transferring a signal charge, a region ofsecond conduction type formed on one side along the charge transferdirection of the well of second conduction type and containing a dopantin a higher concentration than that in the well of second conductiontype, a region of first conduction type formed around each of the regionof second conduction type and the well of second conduction type, and agate electrode covering at least the well of second conduction type andthe region of second conduction type and formed via a gate insulator,comprising at least ion-implanting a dopant of second conduction typeinto the region to be the well of second conduction type and the regionof second conduction type using a mask, and ion-implanting a dopant offirst conduction type from a direction tilted from the normal line ofthe substrate face to one direction unparallel to the charge transferdirection, at predetermined dosage and energy using the above mask.
 5. Amanufacturing process for a charge transfer device comprising a well ofsecond conduction type formed in a well of first conduction type on asemiconductor substrate for transferring a signal charge, a region ofsecond conduction type formed on both sides along the charge transferdirection of the well of second conduction type and containing a dopantin a higher concentration than that in the well of second conductiontype, a region of first conduction type formed around the region ofsecond conduction type, and a gate electrode covering at least the wellof second conduction type and the region of second conduction type andformed via a gate insulator, comprising at least ion-implanting a dopantof second conduction type into the region to be the well of secondconduction type and the region of second conduction type using a mask,ion-implanting a dopant of first conduction type from the firstdirection tilted from the normal line of the substrate face to thedirection unparallel to the charge transfer direction, at the firstdosage and the first energy using the above mask, and ion-implanting adopant of first conduction type from the second direction tilted fromthe normal line of the substrate face to the direction unparallel to thecharge transfer direction, at the second dosage and the second energyusing the above mask.
 6. A manufacturing process for a charge transferdevice as is claimed in claim 5, where the first and the seconddirections form the same angle with the normal line of the substrateface.
 7. A manufacturing process for a charge transfer device as isclaimed in claim 5, where the first and the second directions formdifferent angles with the normal line of the substrate face, so that theregion of second conduction type on the side of the region of firstconduction type with a lower dopant concentration is narrower than thatof the other region of second conduction type in the charge transferdevice where the region of first conduction type formed along one of theregions of second conduction type has a dopant concentration differentfrom that in the other region of first conduction type formed along theother of the regions of the second conduction type.
 8. A manufacturingprocess for a charge transfer device as is claimed in claim 5, whereinthe first and the second dosages are equal.
 9. A manufacturing processfor a charge transfer device as is claimed in claim 6, wherein the firstand the second dosages are equal.
 10. A manufacturing process for acharge transfer device as is claimed in claim 7, wherein the first andthe second dosages are equal.
 11. A manufacturing process for a chargetransfer device as is claimed in claim 5, wherein the first and thesecond energies are equal.
 12. A manufacturing process for a chargetransfer device as is claimed in claim 6, wherein the first and thesecond energies are equal.
 13. A manufacturing process for a chargetransfer device as is claimed in claim 7, wherein the first and thesecond energies are equal.
 14. A manufacturing process for a chargetransfer device as is claimed in claim 5, wherein the first and thesecond dosages are equal, the first and the second energies are equal.15. A manufacturing process for a charge transfer device as is claimedin claim 6, wherein the first and the second dosages are equal, thefirst and the second energies are equal.
 16. A manufacturing process fora charge transfer device as is claimed in claim 7, wherein the first andthe second dosages are equal, the first and the second energies areequal.